Electromigration Failure of Solder Joint
نویسندگان
چکیده
منابع مشابه
Electromigration in Solder Joints and Solder Lines
Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
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One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a sold...
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Wafer Level Chip Scale Package (WLCSP) assemblies were tested under high temperature and high current conditions. Electromigration damage was observed along with accelerated diffusion and intermetallic compound growth at the solder / Under Bump Metallization (UBM) interface. Final electrical failure typically occurred due to a void created in the redistribution line (RDL) near the UBM. The fail...
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Individual effect of thermomigration (TM) and combined effect of TM and electromigration (EM) on the microstructural variation in Sn8Zn3Bi was investigated by stressing line-type Au/Ni–P/Cu-Sn8Zn3Bi-Au/Ni–P/Ni solder joints with a 5 9 10 A/cm alternating current (AC) or direct current (DC) at 110 C. Due to the different thermoelectric characteristics of Cu and Ni wires, a thermal gradient of 19...
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The electromigration-induced failure in the composite solder joints consisting of 97Pb–3Sn on the chip side and 37Pb–63Sn on the substrate side was studied. The under-bump metallization ~UBM! on the chip side was 5 mm thick electroplated Cu coated on sputtered TiW/Cu and on the substrate side was electroless Ni/Au. It was observed that failure occurred in joints in a downward electron flow ~fro...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2012
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.15.369